| Machine name |
Work |
Semiautomatic bonder
|
It automatically feeds brazing materials and chips to the stem which were set on the heater block. |
Automatic optical receiving
die bonder |
It is a full automatic machine to braze three types of stems to various kinds of chips using brazing materials in the heater block in nitrogen atmosphere. |
| Chip die bonder for laser diode
|
It is a full automatic unit to braze sub mount to LD chips using brazing materials on the table in of nitrogen atmosphere.
- Turn table method
- Dry cycle is high-speed at 5 seconds. |
